Computing Architecture Advancements Spur Power Module Innovation　Murata Unveils Versatile Power Management Solutions at OCP Summit

Centralized and modular designs support mainstream server architectures such as OCP and MGX, integrating optical communications and filter components to enhance power and signal stability for AI data centers.

Murata Manufacturing, a global leader in passive electronic components, unveiled a series of advanced power management solutions designed specifically for AI data centers at the 2025 Open Compute Project Asia-Pacific (OCP APAC) Summit. These new offerings include centralized power shelves and board-level DC-DC converter modules, featuring high power density, modular configuration, and flexible rack architecture compatibility. The solutions support various server designs and end specifications such as OCP and NVIDIA MGX. Through its highly adaptable power module strategy, Murata effectively addresses the growing demand for high current supply driven by AI computing, accelerating data center deployment and optimizing spatial efficiency.

According to recent research, the average power density per server rack has increased from approximately 8 kW to 17 kW over the past two years, and is expected to surpass 30 kW by 2027. In response to the explosive power demands and diverse architectures of AI data centers, Murata has launched innovative, high-power-density and highly configurable power solutions. These include centralized power management systems (Power Shelf: ORV3 HPR 33kW / 19-inch/21-inch), power supply units (PSU: mCRPS 3200W) compliant with Intel's DC-MHS standards, and modular, scalable DC-DC converter solutions (DCDC Bricks: 800W/860W/1300W/1600W /2000W ). These offerings enable customers to flexibly plan and build highly integrated, high-performance power architectures according to different server and deployment needs.

More Efficient, Flexible, and Versatile Power Management Solutions
Murata's newly launched power management solutions demonstrate outstanding adaptability to various end-user specifications. Its Power Shelf centralized solution flexibly supports mainstream server architectures such as OCP and NVIDIA MGX and is compatible with both 19-inch and 21-inch racks. It is also suitable for high-power configuration scenarios such as L10 to L11, effectively meeting diverse customer configuration needs. For L6 architectures, Murata also offers compatible PSU and DC-DC converter combinations. The PSU fully complies with Intel DC-MHS standards, and the DCDC Brick line offers multiple sizes—from 1/8 to 1/4 bricks—allowing customers to tailor configurations based on space and power requirements.

In terms of performance, the new series delivers up to 3,200W per module and achieves 80 Plus Titanium certification, the highest energy efficiency rating. These advantages, high power output and modular integration, enhance power stability and overall system efficiency in AI data centers. Moreover, Murata offers flexible supply models to meet the small-volume procurement needs of SMEs during early AI market adoption stages—orders can be fulfilled even for a single unit, significantly lowering the entry barrier for new customers.

Upgraded Optical Communication and Inductor Solutions Fuel Growth in Key Components
Murata also showcased several new optical communication and miniaturized inductor solutions tailored for data centers at the summit. These products are designed to address challenges in signal quality and electromagnetic interference (EMI) management due to increasing data transmission speed and density in the AI era.

In high-speed communication systems, traditional beads and inductors often result in additional voltage drops and high-frequency losses. To address this, Murata introduced high-current ferrite beads, inductors dedicated to optical transceivers, and Datacenter Optical Switch LC filter inductors. These components feature low DCR, anti-saturation capabilities, high-frequency support, and compact form factors. They effectively stabilize high-speed signals such as PCIe Gen6 and are approximately half the size of comparable products on the market. Since launch, this product line has achieved an impressive 120% to 140% year-over-year growth, with widespread applications in AI servers, optical communication modules, and switches, becoming essential components in high-power-density systems.

Partnering to Launch Europe's First OCP Immersion Cooling Data Center
Murata is also actively collaborating with industry partners to promote innovative applications. In the first half of 2025, MiTAC Computing Technology's Capri 2 OCP server—integrated with Murata's power modules—was successfully deployed in a hyperscale data center project by UK-based Stellium. This became Europe's first immersion-cooled data center using the OCP ORv3 architecture. The upcoming Capri 3 server, launched in July 2025, will further deepen this collaboration. This milestone demonstrates the practical experience and deployment capabilities of both companies in integrating high-performance computing and advanced power architecture.

Looking Ahead, Murata will continue strengthening its presence in the Taiwan market, focusing on areas such as communications, computing, automotive electronics, industrial automation, environmental sustainability, and healthcare. By combining advanced product technologies with local partner resources, Murata aims to expand AI application scenarios and deepen the deployment of data center solutions.

To learn more about Murata's solutions, please visit Booth S05 at the 2025 Open Compute Project Asia-Pacific (OCP APAC) Summit.

Reference:
¹ McKinsey & Company, "AI power: Expanding data center capacity to meet growing demand", 2024 (https://www.mckinsey.com/industries/technology-media-and-telecommunications/our-insights/ai-power-expanding-data-center-capacity-to-meet-growing-demand)
² This product is currently under development. Specifications and design are subject to change and will be finalized based on the actual shipping version.
³ This product is currently under development. Specifications and design are subject to change and will be finalized based on the actual shipping version.
⁴ This product is currently under development. Specifications and design are subject to change and will be finalized based on the actual shipping version.